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SDVs Require Support from Semiconductor Partners

To successfully transition to SDVs, automakers must account for upgradeability, flexibility and customizability. The post SDVs Require Support from Semiconductor Partners appeared first on EE Times.

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Startup Builds Cryptography Chip

You have heard CPUs, GPUs and even DPUs, but have you heard about the VPU? Fabric Cryptography, which recently completed a $33 million series A round of investment, is pioneering a brand-new processing...

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TI Begins GaN Production in Japan to Boost Internal Capacity

Texas Instruments' factory in Japan will allow it to internally manufacture 4× more GaN-based power. The post TI Begins GaN Production in Japan to Boost Internal Capacity appeared first on EE Times.

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Gate-All-Around (GAA): The Ultimate Solution to Reduce Leakage 

As awareness of environmental, social, and governance (ESG) issues grows, companies are adopting strategies for sustainable operations. The post Gate-All-Around (GAA): The Ultimate Solution to Reduce...

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RISC-V Oozes Confidence with RVA23 Profile Ratification

RISC-V's confidence surge is due mostly in part with the ratification of the RVA23 Profile. The post RISC-V Oozes Confidence with RVA23 Profile Ratification appeared first on EE Times.

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Chip Odyssey 2006: The Start of the Modern Chip Era

2006 was the year a paradigm shift in semiconductors and chip innovations truly began. The post Chip Odyssey 2006: The Start of the Modern Chip Era appeared first on EE Times.

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Silicon Photonics Set for Takeoff

Silicon photonics demand accelerates, driven by AI, with key players seizing opportunities. The post Silicon Photonics Set for Takeoff appeared first on EE Times.

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Startup Exits Stealth to Automate Source Code Documentation

Driver automates code documentation, reducing it from 28 days to 2 hours. The post Startup Exits Stealth to Automate Source Code Documentation appeared first on EE Times.

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Wine Down Friday with Microchip’s Former CEO, Steve Sanghi

We had the pleasure of speaking with Steve Sanghi, who shares insights from his new book and reflects on his journey from a struggling student to a successful leader. The post Wine Down Friday with...

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3D Integration, Advanced Metrology Shape the Semiconductor Landscape

The surge in AI has pushed the boundaries of chip design and manufacturing. The post 3D Integration, Advanced Metrology Shape the Semiconductor Landscape appeared first on EE Times.

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